
An Intel engineer retains a test glass main substrate panel at Intel’s Assembly and Test Technologies Improvement factories in Chandler, Arizona, in July 2023. Intel’s innovative packaging technologies occur to lifestyle at the company’s Assembly and Take a look at Technologies Progress factories. (Credit rating: Intel Company)
A photo exhibits glass substrate exam units at Intel’s Assembly and Exam Technological innovation Enhancement factories in Chandler, Arizona, in July 2023. Intel’s superior packaging systems appear to daily life at the company’s Assembly and Take a look at Technology Progress factories. (Credit history: Intel Corporation)
Hamid Azimi, company vice president and director of substrate know-how enhancement at Intel Corporation, holds an Intel assembled glass substrate test chip at Intel’s Assembly and Take a look at Technological know-how Enhancement factories in Chandler, Arizona, in July 2023. Intel’s superior packaging technologies arrive to lifestyle at the company’s Assembly and Take a look at Technology Development factories. (Credit: Intel Corporation)





Glass substrates enable prevail over limitations of natural supplies by enabling an buy of magnitude improvement in style and design guidelines necessary for long term facts facilities and AI items.
SANTA CLARA, Calif.–(Company WIRE)–
What’s New: Intel now introduced a person of the industry’s initial glass substrates for following-era sophisticated packaging, prepared for the latter section of this decade. This breakthrough achievement will allow the continued scaling of transistors in a bundle and progress Moore’s Law to supply facts-centric apps.
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Hamid Azimi, company vice president and director of substrate technologies advancement at Intel Company, holds an Intel assembled glass substrate examination chip at Intel’s Assembly and Check Technological innovation Enhancement factories in Chandler, Arizona, in July 2023. Intel’s highly developed packaging technologies arrive to daily life at the firm’s Assembly and Exam Technological innovation Advancement factories. (Credit rating: Intel Company)
“After a decade of exploration, Intel has achieved market-leading glass substrates for superior packaging. We search forward to offering these slicing-edge technologies that will gain our critical gamers and foundry shoppers for decades to appear.”
–Babak Sabi, Intel senior vice president and common supervisor of Assembly and Exam Improvement
Why It Issues: When compared to today’s natural substrates, glass presents distinct houses this kind of as ultra-small flatness and greater thermal and mechanical stability, ensuing in substantially increased interconnect density in a substrate. These rewards will make it possible for chip architects to develop large-density, significant-performance chip offers for info-intense workloads these types of as artificial intelligence (AI). Intel is on keep track of to supply full glass substrate remedies to the marketplace in the 2nd half of this decade, permitting the field to continue advancing Moore’s Legislation beyond 2030.
By the conclusion of the decade, the semiconductor sector will most likely reach its boundaries on staying equipped to scale transistors on a silicon offer making use of organic and natural components, which use additional electrical power and include limits like shrinkage and warping. Scaling is vital to the progress and evolution of the semiconductor sector, and glass substrates are a viable and vital up coming action for the subsequent era of semiconductors.
How It Works: As the need for additional highly effective computing will increase and the semiconductor sector moves into the heterogeneous era that takes advantage of several “chiplets” in a offer, improvements in signaling pace, electricity shipping and delivery, structure rules and steadiness of package deal substrates will be essential. Glass substrates have outstanding mechanical, bodily and optical properties that permit for much more transistors to be related in a deal, furnishing superior scaling and enabling assembly of larger sized chiplet complexes (identified as “system-in-package”) compared to organic substrates in use currently. Chip architects will have the capacity to pack additional tiles – also termed chiplets – in a smaller footprint on a single package deal, when attaining efficiency and density gains with bigger flexibility and lessen overall cost and electricity use.
About the Use Circumstances: Glass substrates will at first be launched into the marketplace where by they can be leveraged the most: purposes and workloads requiring more substantial variety aspect deals (i.e., facts centers, AI, graphics) and greater pace capabilities.
Glass substrates can tolerate increased temperatures, offer you 50% fewer pattern distortion, and have ultra-small flatness for improved depth of concentration for lithography, and have the dimensional stability wanted for particularly tight layer-to-layer interconnect overlay. As a consequence of these unique qualities, a 10x boost in interconnect density is attainable on glass substrates. Further, enhanced mechanical qualities of glass help ultra-big variety-element packages with incredibly significant assembly yields.
Glass substrates’ tolerance to increased temperatures also offers chip architects overall flexibility on how to established the style principles for power delivery and signal routing simply because it provides them the capacity to seamlessly integrate optical interconnects, as properly as embed inductors and capacitors into the glass at better temperature processing. This enables for much better electricity shipping methods even though attaining significant-pace signaling that is essential at significantly lessen electricity. These a lot of advantages provide the market nearer to staying equipped to scale 1 trillion transistors on a deal by 2030.
How We Do It: Intel has been exploring and evaluating the trustworthiness of glass substrates as a alternative for natural and organic substrates for much more than a ten years. The firm has a very long historical past of enabling up coming-era packaging, having led the market in the changeover from ceramic package deal to natural and organic package in the 1990s, remaining the first to help halogen and direct-no cost packages, and being the inventor of state-of-the-art embedded die packaging technologies, the industry’s initially active 3D stacking systems. As a outcome, Intel has been able to unlock an whole ecosystem close to these systems from devices, chemical and supplies suppliers to substrate companies.
What is Future: Creating on the momentum of recent PowerVia and RibbonFET breakthroughs, these sector-main glass substrates for advanced packaging exhibit Intel’s forward target and vision for the following period of compute further than the Intel 18A procedure node. Intel is on the path to providing 1 trillion transistors on a bundle by 2030 and its ongoing innovation in highly developed packaging which include glass substrates will help accomplish this purpose.
Additional Context: Glass Substrates Discussed in 60 Seconds (Video) | Intel Prospects the Way with Innovative Packaging (News) | Superior Packaging with Glass Substrates (Online video B-Roll)
About Intel
Intel (Nasdaq: INTC) is an market chief, producing entire world-changing technologies that permits international progress and enriches life. Motivated by Moore’s Law, we consistently perform to advance the design and style and producing of semiconductors to enable address our customers’ finest worries. By embedding intelligence in the cloud, network, edge and each kind of computing system, we unleash the prospective of information to renovate business and culture for the greater. To study far more about Intel’s innovations, go to newsroom.intel.com and intel.com.
© Intel Corporation. Intel, the Intel emblem and other Intel marks are emblems of Intel Corporation or its subsidiaries. Other names and models could be claimed as the assets of others.
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Robin Holt
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Supply: Intel
Produced Sep 18, 2023 • 9:00 AM EDT

